July 14, 2008 - Frontline announces the release of InPlan™ 2.50
Frontline PCB Solutions announces the release of version 2.50 of its InPlan™ engineering system on July 14, 2008.
InPlan™ 2.50 has a refreshing new graphic style and an improved CAM interface, through panel holes synchronization. Version highlights include dual panel design — the ability to design two panels in a single job — to improve raw material utilization, and deep and line gold plating consideration for parts with edge connectors in panel design.
InPlan™ 2.50 also contains major new impedance coupon generation functionality including guard trace shielding, aligned line termination and multi-assembly testing. Significant improvements are also available in stackup design, traveler processing, and entry form and implementation tools.
See: Support Latest Version section for a full list of new features and enhancements.
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